ESD-safe bin flow racks combine gravity-fed aluminum T-slot frames with conductive roller track, grounded frame assemblies, and ESD bin tray options to create a compliant electrostatic discharge safe material flow system for electronics assembly, PCB handling, and sensitive component storage environments.
ESD-compliant plastic roller track with surface resistance 10⁵–10⁹ Ω — dissipates static charge from bins and components during flow.
Frame uprights bonded to a common ground point with ESD grounding straps — full rack assembly maintains ground continuity for IEC 61340 compliance.
Lanes sized for standard ESD bins and tote trays — conductive bin bases maintain ground path from component to rack frame to floor ground.
Static-dissipative dividers rated 10⁶–10¹⁰ Ω prevent charge buildup between adjacent lanes carrying different component families.
ESD protected area boundary markings integrated into rack base plates and aisle markers — defines EPA boundary without separate floor tape.
Rack design aligned to IEC 61340-5-1 requirements for ESD protected areas — supports customer and third-party ESD audit compliance.
ESD-safe bin lanes supply surface-mount components, connectors, and sub-assemblies to PCB assembly stations within the EPA boundary.
ESD tote trays with kitted components gravity-fed to pick-and-place or hand-assembly stations in FIFO lot sequence.
ESD-safe lanes supply sensitive modules, harnesses, and connectors to final electronics assembly lines — full EPA boundary compliance.
ESD bin flow lanes in incoming inspection areas present component trays to inspectors in lot sequence without removing from ESD packaging.
ESD-safe part supply to board repair technicians — conductive bin lanes ensure components remain within EPA protection from storage to hand.
Wafer trays, die carriers, and JEDEC trays on ESD-safe flow lanes for semiconductor assembly and packaging lines.
MIL-STD-1686 aligned ESD safe bin flow for defense electronics assembly and test environments with stringent ESD control requirements.
ESD-safe component supply for implantable and capital medical device assembly under ISO 13485 quality management requirements.
IEC 61340-5-1 requires track in contact with ESD sensitive components to have a surface resistance of 10⁵ Ω to 10⁹ Ω. Modular Solutions ESD track is tested and certified within this range.
Frame uprights are bonded together with ESD grounding straps and connected to the facility equipotential bonding system via a single ground point. Frame resistance to ground is verified to be < 1 Ω on installation.
No. Standard plastic bins have surface resistances exceeding 10¹² Ω and can charge components to harmful levels. ESD-safe bins with surface resistance 10⁵–10⁹ Ω must be used. Modular Solutions specifies compatible ESD bin options for each installation.
ESD and non-ESD lanes should not share a frame within an EPA boundary — all lanes in an EPA frame must be ESD compliant to prevent charge generation adjacent to sensitive components. Outside the EPA boundary, mixed frames are acceptable.
Modular Solutions provides track resistance test certificates, frame ground test reports, and IEC 61340-5-1 compliance checklist on installation. These documents support customer and third-party ESD audit requirements.
IEC 61340-5-1 recommends periodic retesting — typically annually or after any rack modification. Modular Solutions provides test procedures for in-house re-verification using a standard ESD wrist strap tester and surface resistance meter.
Request a quote or contact our engineering team to discuss your esd-safe bin flow racks requirements.